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Qualcomm Becomes BMW's Lead Chip Supplier for Cockpit and ADAS Through the Next Decade高通签下宝马十年芯片大单，主导座舱与自动驾驶芯片供应
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- Qualcomm announced Wednesday from its San Diego headquarters that it has signed a long-term deal naming Qualcomm Technologies as BMW Group's lead compute silicon provider for next-generation digital cockpit and advanced driver-assistance/autonomous driving (ADAS/AD) systems, running through the next decade.
- The deal spans the Snapdragon Cockpit, Ride, and Elite automotive platforms plus dedicated AI accelerators, though no financial terms were disclosed.
- It builds on Qualcomm's November 2025 Snapdragon Ride Pilot launch, which already powers hands-free driving in BMW's iX3, as rivals Nvidia and Mobileye also compete for long-term automaker chip deals.
- 高通周三从其圣地亚哥总部宣布，已与宝马集团签署长期协议，成为其下一代数字座舱及高级驾驶辅助/自动驾驶（ADAS/AD）系统的首席计算芯片供应商，协议期将覆盖未来十年。
- 该协议涵盖骁龙Cockpit座舱平台、Ride平台及Elite汽车芯片平台，并包含专用AI加速器，但双方未披露具体财务条款。
- 该合作建立在高通2025年11月推出的骁龙Ride Pilot基础之上——该平台已在宝马iX3上实现无手驾驶功能，而英伟达和Mobileye等竞争对手也在争夺类似的长期车企芯片订单。