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Qualcomm Named BMW Group's Lead Compute Silicon Provider for Digital Cockpit and Automated Driving高通成为宝马集团数字座舱与自动驾驶计算芯片首选供应商
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R3-partnership cross-source×2
- Qualcomm announced it has been named BMW Group's lead compute silicon provider for digital cockpit and automated driving systems.
- The agreement extends through the next decade, spanning two core vehicle domains — in-cabin digital cockpit computing and automated driving platforms.
- The source announcement did not disclose chip models, program scope, or financial terms of the deal.
- 高通宣布已被宝马集团任命为数字座舱与自动驾驶系统的首选计算芯片供应商。
- 合作期限贯穿未来十年,覆盖车内数字座舱计算与自动驾驶平台两大核心领域。
- 公告未披露具体芯片型号、项目范围及财务条款等细节。